Dual-Side Corona Treated UL-Certified BOPI Film For Extreme Temperature

This is a high-performance, industrial-grade Biaxially Oriented Polyimide (BOPI) Film engineered for demanding applications where extreme temperature stability, superior mechanical properties, and excellent electrical insulation are required.  The film undergoes a specialized biaxial orientation process for enhanced strength and is treated on both sides with a controlled corona discharge to ensure optimal adhesion for coatings, laminates, and metalization.

· Extreme Temperature Stability: Possesses exceptional high-temperature resistance and outstanding low-temperature resistance, with a high glass transition temperature (Tg).

· Outstanding Mechanical Properties: Exhibits high mechanical strength and is resistant to tearing; offers good rigidity and strong resistance to tensile deformation.

· Superior Electrical Properties: Serves as an ideal electrical insulation material.

· Excellent Chemical Stability: Demonstrates excellent resistance to most organic solvents, oils, greases, and similar substances.
· Flame Resistance: Inherently self-extinguishing, does not support combustion, and complies with stringent flame-retardant standards.

Main Application Areas

· Flexible Printed Circuits (FPCs): As a base substrate for dynamic flex applications.
· Heaters & Sensors: As a durable and heat-resistant dielectric and protective layer in flexible heaters and sensor arrays.
· Barrier & Release Films: For high-temperature processing environments.
· EMI Shielding: As a substrate for metalized films used in electromagnetic interference shielding.
· Specialty Labels & Tapes: For extreme environments where other materials would fail.
· Aerospace and Automotive Electronics: Where reliability under harsh conditions is paramount.

This UL-certified, dual-side treated BOPI film provides manufacturers with a reliable, high-performance material that ensures superior processability and end-product reliability, reducing failure rates and enhancing performance in the most challenging applications.