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Product Details:
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| Base Material: | Polyimide Film | Adhesive: | Imported Silicone Adhesive |
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| Base Film Thickness: | 25um | Tape Thickness: | 60um |
| Width: | 3mm~500mm | Length: | 33m, 33~200m For 500mm Width |
| Color: | Amber Transparent | ||
| High Light: | H Grade Polyimide Film Adhesive Tape,Polyimide Film Adhesive Tape Single Side Coated,No Releasing polyimide adhesive tape |
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PI film heat-resistant protection film
Base film: PI film
Adhesive: silcone adhesive
Appearance:
Amber transparent, surface smooth, no crepe,bubble,foreign objects,no tearing and transfer of glue layer when unwinding
Charactor:
1. Base material with high mechanical strength, good electrial insulation strength, size stable, high temperature resistant.
2. Solvent resistant, and water resistant.
3. Long term working temperature: 220°C, short term 280°C.
Application:
1. Electronic protection during bonding process: especially suitable for SMT wave soldering, temperature protection of reflow soldering, electronic switches, PCB board gold finger protection, SMD electronic transformers, relays and other electronic components that require high temperature and moisture protection.
2. Electrical insulation wrapping: used for coil insulation wrapping of high-demand H-class motors and transformers, wrapping and fixing the ends of high-temperature coils, temperature-resistant thermal resistance protection and other bonding insulation under high-temperature working conditions
| Type # | 2321 | 2321L |
| Total thickness mm | 0.06±0.003 | |
| Base film thickness mm | 0.025±0.003 | |
| Break down voltage KV | ≥5% | |
| Insulation resistance Ω | ≥1013 | |
| Tensile strength N/10mm | ≥40 | |
| Elongation % | ≥45 | |
| Adhetion strength to steel N/10mm | ≥2.4 | |
| Working temperature °C | -73~280 | |
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Chemical resistance 20% HCL NaOH/10Hrs |
Bonding well,do delamination,no glue layer transfer | |
| Releasing film | no | 0.075mm |
Contact Person: Mrs. Sophia Gao
Tel: 0086-13052726305
Fax: 86-411-82802270
